This adapter breaks out a QFN-24 package IC into 0.1″ (2.54mm) spaced pins that match most breadboards and protoboards in the market.

Beside the high quality PCB, this board features a central pad that can dissipate heat from high-power integrated circuits, like motor controllers and audio amplifiers. There is also a hole through the central pad that lets you drop some solder to ensure heat dissipation and conductivity up to the IC. This central pad is connected to a dedicated outer pad, so you can wire a connection to GND (if needed).

It’s Electroless Nickel Immersion Gold (ENIG) contacts offer an excellent surface planarity and oxidation resistance.

This QFN-24 adapter comes in a pack of two boards.

Features

• Standard thickness, high quality PCB.
• Electroless nickel immersion gold (ENIG) contacts.
• Fits any QFN-24 IC (body: 5mm x 5mm, pitch: 0.65mm)
• 0.1″ (2.54mm) spaced pins.
• Central pad for GND connection and/or heat dissipation.
• Central pad hole and dedicated connection pad.