This adapter breaks out a QFN-24 package IC into 0.1″ (2.54mm) spaced pins that match most breadboards and protoboards in the market.

Beside the high quality PCB, this board features a central pad that can dissipate heat from high-power integrated circuits, like motor controllers and audio amplifiers. There is also a hole through the central pad that lets you drop some solder to ensure heat dissipation and conductivity up to the IC. This central pad is connected to a dedicated outer pad, so you can wire a connection to GND (if needed).

It’s Electroless Nickel Immersion Gold (ENIG) contacts offer an excellent surface planarity and oxidation resistance.

This QFN-24 adapter comes in a pack of two boards.


  • Standard thickness, high quality PCB.
  • Electroless nickel immersion gold (ENIG) contacts.
  • Fits any QFN-24 IC (body: 5mm x 5mm, pitch: 0.65mm)
  • 0.1″ (2.54mm) spaced pins.
  • Central pad for GND connection and/or heat dissipation.
  • Central pad hole and dedicated connection pad.

Additional information

Weight 0.010 kg
Dimensions 43 × 20 × 1.5 mm



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QFN-28 to DIP Adapter (6mm x 6mm – P0.65) – Pack of 2

Pack of 2 breakout boards for a QFN-24 (body: 5mm x 57mm, pitch: 0.65mm) package.


In stock

SKU DA-QFN28-6X6P65 Categories , Tags ,

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